Heatsink, SEMIPACK, SEMITRANS, 0.14K/W, 300 x 125 x 135mm

From Semikron, these extruded heatsinks are for use with isolated power modules, and have a polished flat top for mounting to thyristor modules. Constructed from clear or black anodised aluminium they have integrated rails to allow for easy mounting of the modules.
402-383 Black anodised, 135 x 125 x 180 mm
505-2860 Clear anodised, 135 x 125 x 180 mm
505-2876 Clear anodised, 135 x 125 x 300 mm

• If required, a 120mm axial fan may be mounted at one end to increase the airflow through the heat sink.
• Three aluminium sheets 180mm by 100mm by 2mm (not supplied) should be inserted into the integral slots to provide side and bottom airflow plates.
• Additional devices (i.e. thyristors, transistors, power diodes, etc) may be mounted on these side airflow plates. Slots are provided on the top surface for the mounting bars used to bolt down the thyristor packs. The top surface may also be drilled and tapped to accommodate other devices which need heatsinking.

Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins.