Amphenol ICC, AirMax VS 2 mm Pitch Backplane Connector, 6 Column, 9 Row, 54 Way
- RS Stock No.:
- 787-340
- Mfr. Part No.:
- 10039851-101LF
- Brand:
- Amphenol ICC
Subtotal (1 tube of 20 units)*
Kr. 3 724,19
(exc. VAT)
Kr. 4 655,24
(inc. VAT)
FREE delivery for online orders over 750,00 kr
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- Shipping from 31 August 2026
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Tube(s) | Per Tube | Per unit* |
|---|---|---|
| 1 + | Kr. 3 724,19 | Kr. 186,21 |
*price indicative
- RS Stock No.:
- 787-340
- Mfr. Part No.:
- 10039851-101LF
- Brand:
- Amphenol ICC
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol ICC | |
| Product Type | Backplane Connector | |
| Current | 0.5A | |
| Number of Contacts | 54 | |
| Number of Columns | 6 | |
| Number of Rows | 9 | |
| Housing Material | Thermoplastic | |
| Pitch | 2mm | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Standards/Approvals | Telcordia GR-1217-CORE | |
| Series | AirMax VS | |
| Select all | ||
|---|---|---|
Brand Amphenol ICC | ||
Product Type Backplane Connector | ||
Current 0.5A | ||
Number of Contacts 54 | ||
Number of Columns 6 | ||
Number of Rows 9 | ||
Housing Material Thermoplastic | ||
Pitch 2mm | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Standards/Approvals Telcordia GR-1217-CORE | ||
Series AirMax VS | ||
- COO (Country of Origin):
- CN
The Amphenol Connector provides a High performance interconnect solution designed for backplane applications. Utilising innovative technology, it delivers exceptional insertion loss and crosstalk performance for diverse system architectures.
Innovative shieldless design reduces cost and improves flexibility
Open Pin Field Design allows mixing of various signal types
Modules available with multiple pairs and column configurations
Modules from stock ensure short lead times and competitive pricing
Adopted by recognised industry standards enhances design safety
Unique edge-couple technology minimises board layer count and system cost