Molex, 52808-2171 1 mm Pitch 21 Way Right Angle FPC Connector

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Subtotal (1 reel of 1000 units)*

Kr. 6 998,68

(exc. VAT)

Kr. 8 748,35

(inc. VAT)

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Reel(s)
Per Reel
Per unit*
1 +Kr. 6 998,68Kr. 6,999

*price indicative

RS Stock No.:
469-841
Distrelec Article No.:
304-62-608
Mfr. Part No.:
52808-2171
Brand:
Molex
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Brand

Molex

Number of Contacts

21

Product Type

FPC Connector

Contact Material

Phosphor Bronze

Current

0.5A

Pitch

1mm

Mount Type

Surface Mount

Insertion Force

Non-ZIF

Orientation

Right Angle

Voltage

125 V

Series

52808-2171

Minimum Operating Temperature

-20°C

Maximum Operating Temperature

80°C

Standards/Approvals

IEC-62474, EU RoHS, IEC 61249-2-21, IPC 1752A, REACH SVHC

Contact Plating

Tin Bismuth

Housing Material

High Temperature Thermoplastic

COO (Country of Origin):
MY
The TE Connectivity Exceptional connector is engineered to meet the needs of modern electronic assemblies, offering a reliable and efficient interface for flexible printed circuits. The easy-on design enhances user experience, allowing for streamlined connections in surface mount applications. With its vertical orientation and innovative non-ZIF configuration, this connector maximises space while ensuring secure connections across 21 circuits. The combination of high-temperature thermoplastic and tin-bismuth plating materials ensures effective performance in diverse operating conditions, while its thoughtful packaging in embossed tape on reel simplifies automation in production. The connector stands as a testament to both durability and sophistication, making it a prime choice for manufacturers looking for quality and compliance in FFC/FPC interconnect solutions.

Vertical orientation optimises space in compact assemblies

Features non-ZIF design for improved durability during connection and disconnection

Constructed with high-quality materials to withstand demanding applications

Suitable for use in environments with temperature ranges from -20°C to +80°C

Offers a mated height of just 5.05mm, making it ideal for space-critical applications

Packaged efficiently to support automated assembly processes

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