Infineon FF300R12ME7B11BPSA1 Inverter, 300 A 1200 V, 11-Pin AG-ECONOD, Through Hole
- RS Stock No.:
- 232-3041
- Mfr. Part No.:
- FF300R12ME7B11BPSA1
- Brand:
- Infineon
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 232-3041
- Mfr. Part No.:
- FF300R12ME7B11BPSA1
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | Inverter | |
| Maximum Continuous Collector Current Ic | 300A | |
| Maximum Collector Emitter Voltage Vceo | 1200V | |
| Number of Transistors | 2 | |
| Maximum Power Dissipation Pd | 20mW | |
| Package Type | AG-ECONOD | |
| Mount Type | Through Hole | |
| Pin Count | 11 | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 1.75V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | 60068, 60749, IEC 60747 | |
| Length | 152mm | |
| Width | 62.5 mm | |
| Height | 20.5mm | |
| Series | TRENCHSTOPTM IGBT7 | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type Inverter | ||
Maximum Continuous Collector Current Ic 300A | ||
Maximum Collector Emitter Voltage Vceo 1200V | ||
Number of Transistors 2 | ||
Maximum Power Dissipation Pd 20mW | ||
Package Type AG-ECONOD | ||
Mount Type Through Hole | ||
Pin Count 11 | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Maximum Collector Emitter Saturation Voltage VceSAT 1.75V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals 60068, 60749, IEC 60747 | ||
Length 152mm | ||
Width 62.5 mm | ||
Height 20.5mm | ||
Series TRENCHSTOPTM IGBT7 | ||
Automotive Standard No | ||
The Infineon has EconoDUAL 1200 V, 300 A dual TRENCHSTOP IGBT7 module with emitter controlled 7 diode, NTC and PressFIT contact technology. This module has high inter-connection reliability and suitable for press-in and soldering process.
High power density
Isolated base plate
Standard housing
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