Infineon FP50R06W2E3BOMA1 IGBT Module 600 V
- RS Stock No.:
- 244-5401
- Mfr. Part No.:
- FP50R06W2E3BOMA1
- Brand:
- Infineon
Bulk discount available
Subtotal (1 unit)*
Kr. 555,76
(exc. VAT)
Kr. 694,70
(inc. VAT)
FREE delivery for online orders over 750,00 kr
In Stock
- 14 unit(s) ready to ship
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 - 1 | Kr. 555,76 |
| 2 - 4 | Kr. 544,54 |
| 5 + | Kr. 490,09 |
*price indicative
- RS Stock No.:
- 244-5401
- Mfr. Part No.:
- FP50R06W2E3BOMA1
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | IGBT Module | |
| Maximum Collector Emitter Voltage Vceo | 600V | |
| Number of Transistors | 7 | |
| Maximum Power Dissipation Pd | 175W | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 1.9V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 150°C | |
| Height | 12mm | |
| Width | 42.5 mm | |
| Length | 51mm | |
| Series | FP50R06W2E3B | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type IGBT Module | ||
Maximum Collector Emitter Voltage Vceo 600V | ||
Number of Transistors 7 | ||
Maximum Power Dissipation Pd 175W | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Maximum Collector Emitter Saturation Voltage VceSAT 1.9V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 150°C | ||
Height 12mm | ||
Width 42.5 mm | ||
Length 51mm | ||
Series FP50R06W2E3B | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
The infineon IGBT module is suitable for auxiliary inverters, motor drives and air conditioning etc.
Electrical features
Low switching losses
Trench IGBT 3
VCEsat with positive temperature coefficient
Low VCEsat
Mechanical features
Al2O3 substrate with low thermal resistance
Compact design
Solder contact technology
Rugged mounting due to integrated mounting clamps
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