Molex MicroClasp Series Straight Through Hole PCB Header, 9 Contact(s), 2 mm Pitch, 1 Row, Shrouded

Bulk discount available

Subtotal (1 pack of 10 units)*

Kr.101 47 

(exc. VAT)

Kr.126 84 

(inc. VAT)

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Temporarily out of stock
  • 190 unit(s) shipping from 20. juli 2026
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Units
Per unit
Per Pack*
10 - 190Kr. 10,147Kr. 101,47
200 - 740Kr. 8,877Kr. 88,77
750 - 2990Kr. 7,642Kr. 76,42
3000 - 5990Kr. 5,857Kr. 58,57
6000 +Kr. 5,72Kr. 57,20

*price indicative

Packaging Options:
RS Stock No.:
188-096
Distrelec Article No.:
304-57-504
Mfr. Part No.:
55932-0910
Brand:
Molex
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Brand

Molex

Product Type

PCB Header

Series

MicroClasp

Current

3A

Pitch

2mm

Housing Material

Polyester

Number of Contacts

9

Number of Rows

1

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board

Contact Plating

Tin

Contact Material

Tin

Minimum Operating Temperature

-40°C

Row Pitch

2mm

Termination Type

Solder

Contact Gender

Male

Maximum Operating Temperature

105°C

Tail Pin Length

3.2mm

Standards/Approvals

No

Mating Pin Length

2mm

Voltage

250 V

COO (Country of Origin):
JP

Single Row Vertical Header with Boss


A range of 2.00mm Pitch MicroClasp™ Wire-to-Board Headers with Boss.

2.0mm Wire to Board - Molex MicroClasp™ Range


MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The Terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a Compact 2.00mm pitch design.

2.00mm (0.079”) Pitch

Inner Positive Lock

Low insertion force Terminal design

Two-point contact design

High-current contact design

Housing lance system

PCB space savings

Latch protection/secure mating/audible “click”

Easy mating/unmating

Carry up to 3.0A

Terminal protection and secure retention

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