TE Connectivity AMP-LATCH Series Right Angle Board PCB Connector, 14 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

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Subtotal (1 tray of 40 units)*

Kr.2 448 96 

(exc. VAT)

Kr.3 061 20 

(inc. VAT)

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Tray(s)
Per Tray
Per unit*
1 +Kr. 2 448,96Kr. 61,224

*price indicative

RS Stock No.:
468-085
Mfr. Part No.:
104130-2
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

AMP-LATCH

Product Type

PCB Connector

Pitch

2.54mm

Current

1A

Housing Material

Thermoplastic

Number of Contacts

14

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Copper Alloy

Contact Plating

Gold Flash over Nickel

Termination Type

Solder

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.43mm

Standards/Approvals

UL 94 V-0

Distrelec Product Id

304-48-508

Non Compliant with RoHS

COO (Country of Origin):
CN
The TE Connectivity board-to-board connector is designed for seamless integration with ribbon cables, offering a low-profile solution for space-constrained applications. With 14 positions and a 2.54 mm centerline, this connector ensures reliable connections in varied electronic setups. The right-angle orientation and through-hole solder feature facilitate easy mounting on printed circuit boards. Built to withstand harsh environments, it boasts an operating temperature range of -65 to 105 °C, making it ideal for demanding applications. The innovative mating alignment with dual polarizing bar enhances usability, ensuring proper connections every time. Whether it's for consumer electronics or industrial machinery, this connector provides the robustness and performance that engineers require.

Low-profile design optimizes space within electronic devices

Right-angle orientation simplifies PCB layout considerations

Dual polarizing bar aids in correct orientation during installation

High insulation resistance ensures durability and longevity

Constructed with thermoplastic housing for increased reliability

Nickel underplating combined with gold mating area enhances conductivity

Suitable for high-temperature applications, supporting a broad operational range

Ejection latch mechanism provides secure mating retention

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