TE Connectivity 5-173 Series Vertical Board PCB Header, 120 Contact(s), 0.8 mm Pitch, 2 Row, Shrouded

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Subtotal (1 tube of 32 units)*

Kr.3 334 53 

(exc. VAT)

Kr.4 168 16 

(inc. VAT)

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Tube(s)
Per Tube
Per unit*
1 +Kr. 3 334,53Kr. 104,204

*price indicative

RS Stock No.:
469-663
Mfr. Part No.:
5-1735480-5
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

5-173

Pitch

0.8mm

Current

0.5A

Number of Contacts

120

Housing Material

Matt

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Copper Alloy

Contact Plating

Gold Plated

Termination Type

Surface Mount

Minimum Operating Temperature

-40°C

Row Pitch

0.8mm

Maximum Operating Temperature

125°C

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Voltage

100 V

Distrelec Product Id

304-54-183

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Receptacle is perfectly engineered for vertical board-to-board applications, offering exceptional connectivity with its 120 positions and a compact .8 mm centreline. Designed for surface-mount technology, this component showcases a durable construction that includes gold-plated contacts for reliable signal transmission. The receptacle is optimised for free height assembly, enhancing flexibility in layout designs. Its robust electrical characteristics, such as a 100 VAC operating voltage and significant insulation resistance, ensure dependable performance in demanding environments. With a wide operating temperature range, this component is suitable for various industrial applications, making it a versatile choice for engineers seeking to enhance their electronic designs.

Compatibility with various 120-position configurations enhances design flexibility

Gold plating on contact mating areas significantly improves signal integrity

Matte finish minimises reflections and assists in soldering processes

Designed with a mating alignment feature for precise connections

Suitable for a wide array of applications, including signal transmission

Improved dielectric withstand voltage minimises risk in high-voltage scenarios

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