TE Connectivity AMPMODU Series Right Angle Board PCB Header, 6 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

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Subtotal (1 tray of 50 units)*

Kr.2 301 73 

(exc. VAT)

Kr.2 877 16 

(inc. VAT)

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Tray(s)
Per Tray
Per unit*
1 +Kr. 2 301,73Kr. 46,035

*price indicative

RS Stock No.:
471-422
Distrelec Article No.:
304-48-457
Mfr. Part No.:
103166-1
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

6

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board, Wire-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Termination Type

Solder

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.43mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

750 Vrms

COO (Country of Origin):
US
The TE Connectivity PCB Mount Header is designed for seamless integration in both board-to-board and wire-to-board applications. With a right-angle configuration and a fully shrouded header structure, it ensures reliable connections while maximising space efficiency on circuit boards. This component is suitable for various electronic devices, offering exceptional performance featured by its gold plating and robust construction. The connector accommodates six positions in a compact 2.54 mm centreline, allowing for versatile applications across different industries. It promises durability through nickel underplating and significant insulation resistance, making it an excellent choice for demanding environments.

Right angle orientation simplifies installation in space constrained environments

Fully shrouded design enhances reliability and reduces the risk of misalignment

Six position configuration allows for efficient and flexible wiring options

Gold plated contacts ensure superior conductivity and longevity

Rated for high insulation resistance promoting safety in use

Detent window mechanism increases mating retention for improved connection stability

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