TE Connectivity AMPMODU Headers Series Right Angle Board PCB Header, 8 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

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Subtotal (1 tray of 30 units)*

Kr.2 359 50 

(exc. VAT)

Kr.2 949 38 

(inc. VAT)

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Tray(s)
Per Tray
Per unit*
1 +Kr. 2 359,50Kr. 78,65

*price indicative

RS Stock No.:
471-423
Mfr. Part No.:
103167-1
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU Headers

Product Type

PCB Header

Pitch

2.54mm

Current

3A

Housing Material

Thermoplastic

Number of Contacts

8

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Termination Type

Solder

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Maximum Operating Temperature

105°C

Tail Pin Length

3.43mm

Standards/Approvals

CSA LR7189, UL E28476

Voltage

750 Vrms

Distrelec Product Id

304-53-594

Non Compliant with RoHS

COO (Country of Origin):
US
The TE Connectivity PCB Mount Header is designed to provide durable and reliable connections in various applications. With its right-angle configuration and eight positions, this component offers compact design benefits without compromising performance. The fully shrouded header ensures secure locking during mating, contributing to enhanced reliability in critical environments. Built to withstand temperatures ranging from -65°C to 105°C, this product caters to diverse operating conditions. Featuring gold plating for superior conductivity, it answers the demanding needs of modern electronic designs, making it an ideal solution for wire-to-board applications. Moreover, its thermoplastic housing aids in managing thermal stability under load, ensuring the integrity of your connections.

Designed for ease of board mounting with right angle orientation

Fully shrouded design enhances mating security and reduces the risk of misalignment

Robust construction supports fully loaded conditions for reliable performance

Nickel underplating and gold mating area plating ensure excellent conductivity

Compatible with wave soldering processes to simplify assembly

Packaging quantity optimised for efficient inventory management

Delivers solid performance in signal circuit applications

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