Molex 503091 Series Vertical Through Hole PCB Header, 28 Contact(s), 2 mm Pitch, 2 Row, Shrouded

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Subtotal (1 tray of 80 units)*

Kr.2 351 67 

(exc. VAT)

Kr.2 939 59 

(inc. VAT)

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Tray(s)
Per Tray
Per unit*
1 +Kr. 2 351,67Kr. 29,396

*price indicative

RS Stock No.:
476-655
Distrelec Article No.:
304-57-304
Mfr. Part No.:
503091-2821
Brand:
Molex
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Brand

Molex

Product Type

PCB Header

Series

503091

Pitch

2mm

Current

2A

Number of Contacts

28

Housing Material

Polyamide

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Material

Brass

Contact Plating

Gold

Row Pitch

2mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.2mm

Standards/Approvals

CSA LR19880, IEC 61249-2-21, IEC-62474, UL E29179

Voltage

250 Vrms

COO (Country of Origin):
VN
The TE Connectivity 2.00mm pitch, iGrid PCB Header is meticulously engineered for optimal performance in complex applications. This dual-row, vertical connector is specifically designed for through-hole mounting, ensuring a secure fit in diverse PCB configurations. The positive lock mechanism provides reliability and stability even in demanding environments, while the gold plating enhances conductivity and resistance to corrosion. Featuring 28 circuits, this header meets the rigorous standards of today's connectivity requirements. Its robust design, complemented by a PCB locator, makes installation straightforward, minimizing the risk of error during assembly. Tailored for wire-to-board signal applications, this product is an excellent choice for maintaining efficiency and durability in electrical connections.

Engineered for reliable performance in demanding applications

Positive lock mechanism secures connections firmly

Gold plating enhances both conductivity and durability

Designed with a PCB locator for easy installation

Consists of 28 circuits to accommodate complex wiring needs

Suitable for wire-to-board signal applications

Built with robust materials for long-lasting use

Through-hole design provides stability in PCB setups

Durability engineered for high mating cycle requirements

Meets industry standards for environmental compliance

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