TE Connectivity Dynamic 3000 Series Vertical Board PCB Header, 6 Contact(s), 5.08 mm Pitch, 2 Row, Shrouded

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Subtotal (1 tube of 80 units)*

Kr.2 261 46 

(exc. VAT)

Kr.2 826 82 

(inc. VAT)

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  • Shipping from 23. februar 2026
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Tube(s)
Per Tube
Per unit*
1 +Kr. 2 261,46Kr. 28,268

*price indicative

RS Stock No.:
476-893
Distrelec Article No.:
304-51-900
Mfr. Part No.:
3-178140-5
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

Dynamic 3000

Pitch

5.08mm

Current

8A

Number of Contacts

6

Housing Material

Fibreglass Polyester

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Material

Copper Alloy

Contact Plating

Tin Plated

Termination Type

Solder

Row Pitch

5.08mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

TUV, UL 94V-0

Voltage

600 V

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Header is an advanced interconnection solution designed for vertical wire-to-board applications. With its fully shrouded configuration and a pitch of 5.08 mm, this connector ensures reliable and secure connections, essential for powering and signaling in various industries. The product's robust design incorporates a copper alloy contact base, facilitating a high current rating, making it suitable for demanding electrical environments. In addition, the innovative housing material not only meets stringent operating temperature requirements but also guarantees longevity and operational efficiency. As part of the dynamic 3000 Series, it integrates compatibility with a wide range of terminal blocks and connectors, catering to modern electronic assemblies with effortless connectivity.

Designed for vertical PCB mounting, optimizing space utilization within your projects

Copper alloy contact base enhances conductivity and durability

Fully shrouded header ensures safety and prevents contact damage

Polarization aids in correct mating, reducing the risk of assembly errors

Wave solder capability allows for efficient manufacturing processes

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