TE Connectivity AMPMODU Series Vertical Through Hole PCB Header, 2 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

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Subtotal (1 tube of 280 units)*

Kr.3 032 18 

(exc. VAT)

Kr.3 790 22 

(inc. VAT)

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  • Shipping from 23. januar 2026
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Tube(s)
Per Tube
Per unit*
1 +Kr. 3 032,18Kr. 10,829

*price indicative

RS Stock No.:
482-256
Mfr. Part No.:
5-104363-1
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

3A

Number of Contacts

2

Housing Material

Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board

Contact Material

Brass

Contact Plating

Gold

Minimum Operating Temperature

65°C

Termination Type

Solder

Row Pitch

2.54mm

Maximum Operating Temperature

105°C

Tail Pin Length

3.3mm

Mating Pin Length

5.84mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

60 V

Distrelec Product Id

304-52-018

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is an exemplary solution for wire-to-board applications, designed to deliver reliable connectivity in compact electronic devices. This vertically mounted component features a fully shrouded design that ensures secure connections while optimising space utilisation on the printed circuit board. With a centreline of 2.54mm, it accommodates two positions, making it ideal for various electronic configurations. The header is constructed with high-quality materials, including a thermoplastic housing and gold-plated contacts, ensuring durability and optimal performance across a wide range of temperatures. It meets stringent industry standards, making it a dependable choice for engineers and designers seeking robust and compliant connection solutions.

Supports efficient wire-to-board connections, enhancing device functionality

Fully shrouded design minimises accidental disconnections

High operating temperature rating guarantees performance in challenging environments

Matte finish plating reduces friction during mating for smooth operation

Polarised lock mechanism ensures correct alignment during assembly

Versatile enough to be used in various electronic applications

Standardised footprint allows for easy replacement and compatibility with existing designs

Optimised for reflow solder processes, facilitating streamlined assembly

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