TE Connectivity AMPMODU System 50 Series Vertical Board PCB Header, 10 Contact(s), 1.27 mm Pitch, 2 Row, Unshrouded

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Subtotal (1 tube of 140 units)*

Kr.3 991 52 

(exc. VAT)

Kr.4 989 40 

(inc. VAT)

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Tube(s)
Per Tube
Per unit*
1 +Kr. 3 991,52Kr. 28,511

*price indicative

RS Stock No.:
504-407
Mfr. Part No.:
104078-3
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU System 50

Product Type

PCB Header

Current

4A

Pitch

1.27mm

Number of Contacts

10

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Alloy

Row Pitch

1.27mm

Termination Type

Solder

Minimum Operating Temperature

65°C

Contact Gender

Female

Maximum Operating Temperature

105°C

Tail Pin Length

2.54mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

30 V

Distrelec Product Id

304-53-627

Non Compliant with RoHS

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Receptacle offers an innovative solution for board-to-board connections, featuring a vertical orientation designed for maximum efficiency and space-saving. With its 10 position capability and a centerline pitch of 1.27 mm [.05 in], this advanced connector system, part of the AMPMODU System 50 range, ensures streamlined integration in compact electronic designs. Crafted with gold (Au) plating for enhanced conductivity and reliability, this through-hole solder receptacle is suited for a wide variety of signal applications. The durable thermoplastic housing and robust copper alloy contacts ensure longevity and consistent performance across various operating environments. Ideal for both commercial and industrial use, this receptacle supports rigorous operational requirements while maintaining low insertion force.

Vertical PCB mount design optimizes space in confined areas

10-position configuration enhances connectivity options

Gold plating ensures superior electrical performance

Thermoplastic housing provides robust durability

Compatible with various board configurations for versatile applications

Designed to withstand high operating temperatures, promoting reliability

Solder process capability simplifies installation and enhances manufacturing efficiency

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