Molex 55959 Series Vertical Through Hole PCB Header, 24 Contact(s), 2 mm Pitch, 2 Row, Shrouded

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Subtotal (1 pack of 5 units)*

Kr. 65,70

(exc. VAT)

Kr. 82,12

(inc. VAT)

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  • Plus 64 unit(s) shipping from 13 July 2026
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Pack(s)
Per Pack
Per unit*
1 - 4Kr. 65,70Kr. 13,14
5 - 9Kr. 60,48Kr. 12,096
10 +Kr. 52,05Kr. 10,41

*price indicative

RS Stock No.:
665-857
Mfr. Part No.:
559592430
Brand:
Molex
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Brand

Molex

Product Type

PCB Header

Series

55959

Current

3A

Pitch

2mm

Housing Material

Polyester

Number of Contacts

24

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board

Contact Plating

Tin

Contact Material

Tin

Minimum Operating Temperature

-40°C

Termination Type

Through Hole

Maximum Operating Temperature

105°C

Tail Pin Length

3.2mm

Contact Gender

Male

COO (Country of Origin):
JP
The Molex MicroClasp is a 2.00mm Pitch Wire-to-Board Header designed to provide secure and reliable connections in electronic applications. With its right-angle orientation and dual-row configuration, it efficiently accommodates up to 24 circuits, making it Ideal for space-sensitive designs. This Active component ensures high durability and effective signal transmission, making it perfect for various PCB applications. The robust construction and materials used offer resilience across a wide operational temperature range of -40° to +105°C, ensuring reliable performance in diverse environments. Weighing just 2869.400 mg, the MicroClasp seamlessly integrates into your projects, offering a practical solution for your connectivity needs.

Active status ensures ongoing availability for your projects
Dual row design supports up to 24 circuits, optimising space usage
Right angle orientation facilitates easier PCB routing and assembly
Maximum current rating of 3.0A per contact for efficient power distribution
Made from Durable polyester resin, offering long-lasting performance
Flammability rated at 94V-0 ensures safety in electronics
Clean mating Interface allows for low mating cycles of up to 30, prolonging component life
Compatible with MicroClasp Dual Row Receptacle for enhanced connectivity options

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