TE Connectivity Micro Stack Series Vertical Board Connector Assembly, 80 Contact(s), 0.6 mm Pitch, 2 Row, Shrouded

RS Stock No.:: 677-531
Mfr. Part No.:: 6376611-1
Brand:: TE Connectivity

TE Connectivity Micro Stack Series Vertical Board Connector Assembly, 80 Contact(s), 0.6 mm Pitch, 2 Row, Shrouded

Subtotal (1 tray of 60 units)*

Kr. 2 569,50

(exc. VAT)

Kr. 3 211,88

(inc. VAT)

Stock information currently inaccessible - Please check back later

Tray(s)	Per Tray	Per unit*
1 +	Kr. 2 569,50	Kr. 42,825

*price indicative

RS Stock No.:: 677-531
Mfr. Part No.:: 6376611-1
Brand:: TE Connectivity

Specifications

Technical Reference

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	TE Connectivity
	Product Type	Connector Assembly
	Series	Micro Stack
	Pitch	0.6mm
	Current	0.5A
	Housing Material	Liquid Crystal Polymer
	Number of Contacts	80
	Number of Rows	2
	Orientation	Vertical
	Shrouded/Unshrouded	Shrouded
	Mount Type	Board
	Connector System	Board-to-Board
	Contact Plating	Gold
	Contact Material	Copper Alloy
	Termination Type	Surface Mount
	Minimum Operating Temperature	-55°C
	Contact Gender	Male
	Maximum Operating Temperature	85°C
	Standards/Approvals	UL
	Voltage	10V

	Select all
	Brand TE Connectivity
	Product Type Connector Assembly
	Series Micro Stack
	Pitch 0.6mm
	Current 0.5A
	Housing Material Liquid Crystal Polymer
	Number of Contacts 80
	Number of Rows 2
	Orientation Vertical
	Shrouded/Unshrouded Shrouded
	Mount Type Board
	Connector System Board-to-Board
	Contact Plating Gold
	Contact Material Copper Alloy
	Termination Type Surface Mount
	Minimum Operating Temperature -55°C
	Contact Gender Male
	Maximum Operating Temperature 85°C
	Standards/Approvals UL
	Voltage 10V

Datasheet - 6376611-1

COO (Country of Origin):: CN

The TE Connectivity PCB Mount Header is optimized for high-density board-to-board signal transmission in Compact electronic designs. With 80 positions and a fine 0.6 mm [.023 in] centerline spacing, it enables efficient routing while conserving valuable PCB real estate. Its partially shrouded vertical surface-mount configuration ensures precise mating and supports automated assembly.

80 Positions for dense signal interconnects

0.6 mm [.023 in] Centerline spacing for Compact layouts

Partially Shrouded Housing improves alignment and mechanical stability

Gold-Plated Contacts (Au) for superior conductivity and corrosion resistance

Surface-Mount Design supports streamlined board stacking and reflow soldering

TE Connectivity Micro Stack Series Vertical Board Connector Assembly, 80 Contact(s), 0.6 mm Pitch, 2 Row, Shrouded

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