Amphenol ICC 10112690 Series Right Angle Surface PCB Header, 8 Contact(s), 2 mm Pitch, 2 Row, Unshrouded
- RS Stock No.:
- 787-119
- Mfr. Part No.:
- 10112690-G03-08ULF
- Brand:
- Amphenol ICC
Subtotal (1 tube of 120 units)*
Kr. 2 096,38
(exc. VAT)
Kr. 2 620,48
(inc. VAT)
FREE delivery for online orders over 750,00 kr
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- Shipping from 18 August 2026
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Tube(s) | Per Tube | Per unit* |
|---|---|---|
| 1 + | Kr. 2 096,38 | Kr. 17,47 |
*price indicative
- RS Stock No.:
- 787-119
- Mfr. Part No.:
- 10112690-G03-08ULF
- Brand:
- Amphenol ICC
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol ICC | |
| Series | 10112690 | |
| Product Type | PCB Header | |
| Pitch | 2mm | |
| Number of Contacts | 8 | |
| Housing Material | Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | Surface | |
| Connector System | Wire-to-Board | |
| Contact Plating | Tin | |
| Contact Material | Copper | |
| Row Pitch | 2mm | |
| Termination Type | Surface Mount | |
| Contact Gender | Male | |
| Select all | ||
|---|---|---|
Brand Amphenol ICC | ||
Series 10112690 | ||
Product Type PCB Header | ||
Pitch 2mm | ||
Number of Contacts 8 | ||
Housing Material Thermoplastic | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type Surface | ||
Connector System Wire-to-Board | ||
Contact Plating Tin | ||
Contact Material Copper | ||
Row Pitch 2mm | ||
Termination Type Surface Mount | ||
Contact Gender Male | ||
- COO (Country of Origin):
- FR
The Amphenol Header is a reliable connection solution designed for industrial applications, ensuring durability and efficient performance in various settings. It meets the demands of contemporary use with its robust construction.
Features a Durable design for long-lasting use
Optimised for high performance in industrial settings
Ensures reliability under various environmental conditions
Supports efficient connectivity for streamlined operations
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