Molex 4455 Series Right Angle Through Hole PCB Header, 12 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 787-525
- Mfr. Part No.:
- 22-16-2120
- Brand:
- Molex
Subtotal (1 tray of 200 units)*
Kr. 5 003,05
(exc. VAT)
Kr. 6 253,81
(inc. VAT)
FREE delivery for online orders over 750,00 kr
Stocked by manufacturer
- Ready to ship from 02 December 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Tray(s) | Per Tray | Per unit* |
|---|---|---|
| 1 + | Kr. 5 003,05 | Kr. 25,015 |
*price indicative
- RS Stock No.:
- 787-525
- Mfr. Part No.:
- 22-16-2120
- Brand:
- Molex
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Product Type | PCB Header | |
| Series | 4455 | |
| Current | 2.5A | |
| Pitch | 2.54mm | |
| Number of Contacts | 12 | |
| Housing Material | Nylon | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Bronze | |
| Contact Plating | Gold | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Male | |
| Voltage | 500V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Product Type PCB Header | ||
Series 4455 | ||
Current 2.5A | ||
Pitch 2.54mm | ||
Number of Contacts 12 | ||
Housing Material Nylon | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Material Bronze | ||
Contact Plating Gold | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Male | ||
Voltage 500V | ||
- COO (Country of Origin):
- MY
The Molex Board Connector provides a High performance Interface for complex PCB assemblies and High density electronic systems. This precision-engineered component facilitates stable signal transmission while its specialized orientation allows for efficient vertical stacking or perpendicular board integration to maximise internal enclosure space.
Offers enhanced connectivity through its robust design
Facilitates easy installation with user-friendly features
Supports high-speed data transfer for modern electronic devices
Constructed to withstand rigorous industrial environments
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