Amphenol ICC 10075025 Series Straight Through Hole PCB Header, 20 Contact(s), 2 mm Pitch, 2 Row, Shrouded
- RS Stock No.:
- 787-611
- Mfr. Part No.:
- 10075025-G01-20ULF
- Brand:
- Amphenol ICC
Subtotal (1 tube of 100 units)*
Kr. 2 280,35
(exc. VAT)
Kr. 2 850,44
(inc. VAT)
FREE delivery for online orders over 750,00 kr
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- Shipping from 17 June 2026
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Tube(s) | Per Tube | Per unit* |
|---|---|---|
| 1 + | Kr. 2 280,35 | Kr. 22,804 |
*price indicative
- RS Stock No.:
- 787-611
- Mfr. Part No.:
- 10075025-G01-20ULF
- Brand:
- Amphenol ICC
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol ICC | |
| Product Type | PCB Header | |
| Series | 10075025 | |
| Pitch | 2mm | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 20 | |
| Number of Rows | 2 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Copper | |
| Contact Plating | Gold | |
| Row Pitch | 2mm | |
| Termination Type | Through Hole | |
| Contact Gender | Male | |
| Select all | ||
|---|---|---|
Brand Amphenol ICC | ||
Product Type PCB Header | ||
Series 10075025 | ||
Pitch 2mm | ||
Housing Material Thermoplastic | ||
Number of Contacts 20 | ||
Number of Rows 2 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Copper | ||
Contact Plating Gold | ||
Row Pitch 2mm | ||
Termination Type Through Hole | ||
Contact Gender Male | ||
- COO (Country of Origin):
- FR
The Amphenol Header is designed to ensure reliable connections in demanding environments. Its robust construction and precise engineering provide exceptional performance for various applications while maintaining durability and integrity.
Constructed for longevity, ensuring reliable performance over time
Designed to withstand harsh environmental conditions without compromising functionality
Features precise engineering for consistent and efficient connectivity
Optimised for enhanced signal integrity across diverse applications
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