Molex 54363 Series Vertical Board PCB Socket, 40-Contact, 2 Row, 0.5 mm Pitch Surface Mount

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Subtotal (1 reel of 2500 units)*

Kr.54 792 17 

(exc. VAT)

Kr.68 490 21 

(inc. VAT)

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Reel(s)
Per Reel
Per unit*
1 +Kr. 54 792,17Kr. 21,917

*price indicative

RS Stock No.:
469-767
Distrelec Article No.:
304-57-463
Mfr. Part No.:
54363-0489
Brand:
Molex
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Brand

Molex

Number of Contacts

40

Product Type

PCB Socket

Sub Type

PCB Receptacle

Number of Rows

2

Current

0.5A

Pitch

0.5mm

Termination Type

Surface Mount

Housing Material

High Temperature Thermoplastic

Mount Type

Board

Orientation

Vertical

Stacking Height

2mm

Voltage

50 Vrms

Series

54363

Minimum Operating Temperature

-40°C

Row Pitch

0.5mm

Contact Material

Phosphor Bronze

Maximum Operating Temperature

105°C

Contact Plating

Gold

Standards/Approvals

No

COO (Country of Origin):
JP
The TE Connectivity High-performance connector offers exceptional reliability and versatility in board-to-board applications. Engineered for precision, it features a slim design that ensures efficient use of space without compromising connectivity. The connector’s dual row configuration accommodates 40 circuits, making it an ideal choice for complex electronic systems. Its robust construction, including a high-temperature thermoplastic resin and gold-plated contact surfaces, guarantees durability and longevity under various environmental conditions. Operating within a temperature range from -40° to +105°C, it is well-suited for demanding applications. The surface mount design enhances ease of installation, while the embossed tape on reel packaging simplifies handling and integration into production lines.

Engineered for space efficiency while maintaining high-performance standards

Dual row configuration supports up to 40 circuits for enhanced connectivity

Constructed from high-temperature thermoplastic for increased durability

Gold plating provides excellent electrical conductivity and corrosion resistance

Designed for easy surface mount installation, streamlining the assembly process

Operational temperature range ensures reliability in diverse environments

Embossed tape packaging facilitates straightforward integration into manufacturing workflows

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