TE Connectivity 5-146 Series Vertical Board PCB Socket, 16-Contact, 2 Row, 0.1 in Pitch Solder

Subtotal (1 pack of 65 units)*

Kr.1 973 63 

(exc. VAT)

Kr.2 467 04 

(inc. VAT)

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Per Pack
Per unit*
1 +Kr. 1 973,63Kr. 30,364

*price indicative

RS Stock No.:
476-721
Distrelec Article No.:
304-54-160
Mfr. Part No.:
5-146255-8
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Socket

Number of Contacts

16

Sub Type

Header Assembly

Number of Rows

2

Pitch

0.1in

Termination Type

Solder

Mount Type

Board

Orientation

Vertical

Connector System

AMPMODU INTERCONNECTION SYSTEM

Series

5-146

Maximum Operating Temperature

260°C

Standards/Approvals

2016, China RoHS 2 MIIT Order No 32, EU ELV 2000/53/EC, EU RoHS 2011/65/EU

COO (Country of Origin):
MX
The TE Connectivity connector from the AMPMODU interconnection system is designed to meet rigorous standards for reliability and functionality within electronic applications. Its advanced design ensures robust connections in challenging environments. Engineered for ease of use, this connector offers a straightforward installation process while ensuring secure connections, making it an ideal choice for various applications. With a focus on compliance, this product meets essential environmental directives, ensuring its suitability for a wide range of sectors. Its compact form factor does not compromise on performance, ensuring efficiency in data transmission and connection stability, making it an essential component for modern electronic assemblies.

Optimised for high-density configurations, enhancing space efficiency

Designed for pin-in-paste solder process, assuring compatibility with advanced assembly techniques

Constructed with halogen-free materials, supporting environmentally conscious manufacturing

Meets stringent EU RoHS compliance standards for hazardous materials, ensuring safety and sustainability

Features low bromine and chlorine content, promoting environmental friendliness

Includes a range of compatible parts for versatile applications across various systems

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