TE Connectivity AMPMODU Series Vertical Board PCB Socket, 280-Contact, 2 Row, 0.6 mm Pitch Surface Mount

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Subtotal (1 tray of 6 units)*

Kr.2 005 09 

(exc. VAT)

Kr.2 506 36 

(inc. VAT)

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Tray(s)
Per Tray
Per unit*
1 +Kr. 2 005,09Kr. 334,182

*price indicative

RS Stock No.:
501-537
Distrelec Article No.:
304-53-526
Mfr. Part No.:
1-5353729-0
Brand:
TE Connectivity
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Brand

TE Connectivity

Number of Contacts

280

Product Type

PCB Socket

Number of Rows

2

Sub Type

PCB Receptacle

Current

0.5A

Pitch

0.6mm

Housing Material

High Temperature Thermoplastic

Termination Type

Surface Mount

Mount Type

Board

Orientation

Vertical

Connector System

Board-to-Board

Stacking Height

12mm

Voltage

50 V

Series

AMPMODU

Minimum Operating Temperature

-40°C

Row Pitch

0.6mm

Contact Gender

Female

Contact Plating

Gold

Maximum Operating Temperature

85°C

Contact Material

Copper Alloy

Standards/Approvals

UL 94 V-0

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Receptacle is expertly designed for vertical, board-to-board connectivity, catering specifically to applications requiring a reliable and compact solution. This connector boasts a remarkable 280 positions, allowing for robust signal transmission while maintaining a sleek profile. Crafted with high-quality materials, it features a 0.6 mm centreline pitch, ensuring minimal space usage while supporting an efficient layout on PCBs. The gold-plated contacts enhance durability and performance, making it ideal for demanding environments. With a surface mount design, installation is simplified, promoting faster assembly processes. The product's versatility is complemented by its broad operating temperature range, allowing it to function effectively in various conditions. By focusing on performance and reliability, this receptacle stands out as a premium choice for modern electronic designs.

Supports board-to-board configurations with ease

Designed with stackable features for versatile applications

Utilises high-temperature thermoplastic for housing durability

Ensures effective electrical connections with grounding contacts

Offers a compact footprint while accommodating a high number of positions

Facilitates reflow solder capabilities to enhance manufacturing efficiency

Incorporates a well-defined mating alignment system for error-free connections

Features intrinsic resistance to thermal and environmental extremes

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