Specifications

Technical Reference

Legislation and Compliance

Product Details

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Select all	Attribute	Value
	Brand	Amphenol Communications Solutions
	Product Type	PCB Socket
	Number of Contacts	40
	Number of Rows	2
	Sub Type	Board-to-Board
	Pitch	0.8mm
	Current	800mA
	Termination Type	Solder
	Housing Material	Glass Filled Liquid Crystal Polymer
	Mount Type	Surface
	Orientation	Straight
	Connector System	Board-to-Board
	Stacking Height	20mm
	Voltage	100 V
	Series	BergStak
	Minimum Operating Temperature	-40°C
	Contact Plating	Gold
	Maximum Operating Temperature	125°C
	Contact Material	Copper
	Contact Gender	Female
	Standards/Approvals	No

	Select all
	Brand Amphenol Communications Solutions
	Product Type PCB Socket
	Number of Contacts 40
	Number of Rows 2
	Sub Type Board-to-Board
	Pitch 0.8mm
	Current 800mA
	Termination Type Solder
	Housing Material Glass Filled Liquid Crystal Polymer
	Mount Type Surface
	Orientation Straight
	Connector System Board-to-Board
	Stacking Height 20mm
	Voltage 100 V
	Series BergStak
	Minimum Operating Temperature -40°C
	Contact Plating Gold
	Maximum Operating Temperature 125°C
	Contact Material Copper
	Contact Gender Female
	Standards/Approvals No

Receptacle Assembly Drawing

COO (Country of Origin):: MY

0.8mm Bergstak® Series

These FCI Bergstk® high density 0.8mm pitch SMT connectors provide space saving in board to board stacking applications.

Blade-on-beam contacts allow ’peeling’ and prevent ’stubbing’

The Bergstak® system from FCI are high density parallel board to board connectors which can be configured to various PCB stack heights. These Bergstak® connectors are polarized, have generous lead-in angles with precise contact positioning ensuring precise mating alignment and reliability.

Amphenol Communications Solutions BergStak Series Straight Surface PCB Socket, 40-Contact, 2 Row, 0.8 mm Pitch Solder

0.8mm Bergstak® Series

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