Samtec ASP Series Straight Surface PCB Socket, 50-Contact, 2 Row, 0.8 mm Pitch Solder
- RS Stock No.:
- 180-2492
- Mfr. Part No.:
- ASP-148422-01
- Brand:
- Samtec
Subtotal (1 pack of 375 units)*
Kr.25 113 375
(exc. VAT)
Kr.31 391 625
(inc. VAT)
FREE delivery for online orders over 500,00 kr
Temporarily out of stock
- Shipping from 25. mars 2026
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Units | Per unit | Per Pack* |
|---|---|---|
| 375 + | Kr. 66,969 | Kr. 25 113,38 |
*price indicative
- RS Stock No.:
- 180-2492
- Mfr. Part No.:
- ASP-148422-01
- Brand:
- Samtec
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 50 | |
| Number of Rows | 2 | |
| Sub Type | Socket Assembly | |
| Current | 2.7A | |
| Pitch | 0.8mm | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Stacking Height | 22mm | |
| Connector System | Board-to-Board | |
| Voltage | 339 V | |
| Series | ASP | |
| Row Pitch | 3.36mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 125°C | |
| Contact Material | Beryllium Copper Alloy | |
| Contact Plating | Gold over Nickel | |
| Standards/Approvals | RoHS | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 50 | ||
Number of Rows 2 | ||
Sub Type Socket Assembly | ||
Current 2.7A | ||
Pitch 0.8mm | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Stacking Height 22mm | ||
Connector System Board-to-Board | ||
Voltage 339 V | ||
Series ASP | ||
Row Pitch 3.36mm | ||
Minimum Operating Temperature -55°C | ||
Contact Gender Female | ||
Maximum Operating Temperature 125°C | ||
Contact Material Beryllium Copper Alloy | ||
Contact Plating Gold over Nickel | ||
Standards/Approvals RoHS | ||
The Samtec PCB Socket ASP series is a surface mount PCB socket. As advances in semiconductor and system design continue, embedded applications are using higher performance embedded processors. Efficient use of these embedded processors requires software and hardware development tools that can easily access critical processor functionality.
Contact Plating: Gold over Nickel
Contact Material: Beryllium Copper
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