TE Connectivity, Z-PACK 1.9 mm Pitch High Speed High Speed Backplane Connector, Vertical Male, 8 Column, 15 Row, 120 Way
- RS Stock No.:
- 472-295
- Distrelec Article No.:
- 304-49-452
- Mfr. Part No.:
- 1934271-1
- Brand:
- TE Connectivity
Subtotal (1 tube of 28 units)*
Kr. 3 624,99
(exc. VAT)
Kr. 4 531,24
(inc. VAT)
FREE delivery for online orders over 500,00 kr
Temporarily out of stock
- Shipping from 30 March 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Tube(s) | Per Tube | Per unit* |
|---|---|---|
| 1 + | Kr. 3 624,99 | Kr. 129,464 |
*price indicative
- RS Stock No.:
- 472-295
- Distrelec Article No.:
- 304-49-452
- Mfr. Part No.:
- 1934271-1
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Product Type | High Speed Backplane Connector | |
| Backplane Connector Type | High Speed | |
| Number of Contacts | 120 | |
| Current | 0.5A | |
| Orientation | Vertical | |
| Number of Columns | 8 | |
| Connector Gender | Male | |
| Number of Rows | 15 | |
| Voltage | 250 V | |
| Housing Material | Liquid Crystal Polymer | |
| Pitch | 1.9mm | |
| Contact Material | Phosphor Bronze | |
| Mount Type | Board | |
| Contact Plating | Gold, Tin | |
| Termination Type | Solder | |
| Minimum Operating Temperature | 65°C | |
| Maximum Operating Temperature | 90°C | |
| Contact Gender | Male | |
| Standards/Approvals | 2016, UL 94V-0, UL, China RoHS 2 Directive MIIT Order No 32, EU REACH Regulation (EC) No. 1907/2006, UL E28476, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant | |
| Series | Z-PACK | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Product Type High Speed Backplane Connector | ||
Backplane Connector Type High Speed | ||
Number of Contacts 120 | ||
Current 0.5A | ||
Orientation Vertical | ||
Number of Columns 8 | ||
Connector Gender Male | ||
Number of Rows 15 | ||
Voltage 250 V | ||
Housing Material Liquid Crystal Polymer | ||
Pitch 1.9mm | ||
Contact Material Phosphor Bronze | ||
Mount Type Board | ||
Contact Plating Gold, Tin | ||
Termination Type Solder | ||
Minimum Operating Temperature 65°C | ||
Maximum Operating Temperature 90°C | ||
Contact Gender Male | ||
Standards/Approvals 2016, UL 94V-0, UL, China RoHS 2 Directive MIIT Order No 32, EU REACH Regulation (EC) No. 1907/2006, UL E28476, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant | ||
Series Z-PACK | ||
- COO (Country of Origin):
- CN
The TE Connectivity 120 Position High Speed Backplane Connector is expertly engineered to facilitate seamless data transmission in high-performance applications. Designed with 15 rows and 8 columns, this PCB mount header is fully shrouded and features a 1.9 mm centreline, providing reliable connectivity in compact spaces. Its robust construction and impressive specifications ensure optimal signal integrity, making it an ideal choice for traditional backplane architectures. With an operating voltage of 250 VAC and an impedance of 100 Ω, this connector is built to handle demanding electrical environments while maintaining peak performance. Whether used in telecommunications, computing, or industrial systems, this component ensures durability and reliability across various applications, setting a benchmark in connector technology.
Robust construction for maximum durability in various environments
Optimised for high-speed data applications, supporting data rates of up to 10 Gb/s
Differential impedance maintains signal integrity for reliable performance
Vertical PCB mount orientation allows for effective space management
Advanced mating alignment features ensure secure connections during operation
Low halogen content supports environmentally responsible practices
Matte finish plating enhances resistance to wear and tear
Easy integration into traditional backplane architectures for versatile applications
Configured with compliant tail technology for improved retention during assembly