Bopla BoLink Series Seal for Use with BoPad 10.1 Enclosures, 291 x 204 x 54.3mm

The Bopla BoLink IoT Enclosure is a sensor enclosure which is made of polycarbonate material. It is a very intelligent and versatile enclosure system for modern IoT sensor technology. The enclosure is available in three variants without wall brackets, with wall brackets, with wall brackets and lid fixing on top. The PC material is suitable for outdoor use due to f1-listing according to UL 746C.

IP65 rating
UL 94 V0 Fire class
Design seal optional