Transcend TS1TMTE370T 2230-S3-M 1 TB Internal SSD
- RS Stock No.:
- 175-421
- Mfr. Part No.:
- TS1TMTE370T
- Brand:
- Transcend
Supply shortage
Due to a global supply shortage, we don't know when this will be back in stock.
- RS Stock No.:
- 175-421
- Mfr. Part No.:
- TS1TMTE370T
- Brand:
- Transcend
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Transcend | |
| Memory Size | 1TB | |
| Sub Type | SSD | |
| Model Number | TS1TMTE370T | |
| Product Type | SSD | |
| Internal/External | Internal | |
| Form Factor | 2230-S3-M | |
| Industrial Grade | Yes | |
| NAND Type | 3D TLC | |
| Interface Type | PCIe Gen 3.0 x4 NVMe | |
| Encryption Level | AES | |
| Minimum Operating Temperature | -20°C | |
| Maximum Operating Temperature | 75°C | |
| Standards/Approvals | BSMI, CE, FCC, RoHS, UKCA | |
| Width | 22mm | |
| Length | 30mm | |
| Height | 2.38mm | |
| Select all | ||
|---|---|---|
Brand Transcend | ||
Memory Size 1TB | ||
Sub Type SSD | ||
Model Number TS1TMTE370T | ||
Product Type SSD | ||
Internal/External Internal | ||
Form Factor 2230-S3-M | ||
Industrial Grade Yes | ||
NAND Type 3D TLC | ||
Interface Type PCIe Gen 3.0 x4 NVMe | ||
Encryption Level AES | ||
Minimum Operating Temperature -20°C | ||
Maximum Operating Temperature 75°C | ||
Standards/Approvals BSMI, CE, FCC, RoHS, UKCA | ||
Width 22mm | ||
Length 30mm | ||
Height 2.38mm | ||
- COO (Country of Origin):
- TW
Transcend SSD, 1TB Memory Size, PCIe Gen 3.0 x4 NVMe Interface Type - TS1TMTE370T
This SSD is an internal NVMe storage device designed for embedded and industrial environments, delivering high-capacity solid-state storage over a PCIe Gen3 x4 link. It operates across a broad temperature range and implements hardware-level encryption to protect stored data while fitting Compact system designs.
Features and Benefits:
• 1TB capacity provides large local data storage
• PCIe Gen3 x4 Interface enables high-throughput transfers
• 3D TLC NAND offers balanced endurance and density
• AES hardware encryption secures stored information
• Industrial-grade design supports prolonged field use
• Conforms to RoHS, CE, FCC and UKCA regulatory standards
• PCIe Gen3 x4 Interface enables high-throughput transfers
• 3D TLC NAND offers balanced endurance and density
• AES hardware encryption secures stored information
• Industrial-grade design supports prolonged field use
• Conforms to RoHS, CE, FCC and UKCA regulatory standards
Applications
• Suitable for industrial embedded controllers requiring local storage
• Ideal for IoT gateways with limited internal space
• Used with automotive and transport data-logging systems
• Can be used for edge compute nodes in harsh climates
• Useful for secure on-device data retention in appliances
• Ideal for IoT gateways with limited internal space
• Used with automotive and transport data-logging systems
• Can be used for edge compute nodes in harsh climates
• Useful for secure on-device data retention in appliances
What temperature extremes can it tolerate in operation?
It functions across an operating range from -20°C to 75°C, supporting deployment in hot and cold environments.
What form factor is required for installation in Compact systems?
The drive uses the 2230-S3-M form factor, compatible with systems accepting 2230 M.2 modules.
Which NAND technology does the device use and why does that matter?
It employs 3D TLC memory, which provides a balance between storage density and write endurance suited to many industrial workloads.
What connectivity standard must a host support for full performance?
The host must provide a PCIe Gen3 x4 NVMe Interface to achieve the intended data throughput.
Which certifications indicate suitability for regulated markets?
The unit holds BSMI, CE, FCC and RoHS approvals along with UKCA marking for applicable jurisdictions.
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