Fischer Elektronik Heatsink, Ball Grid Array 6 mm 10 mm 10 mm

Subtotal (1 pack of 50 units)*

Kr. 957,18

(exc. VAT)

Kr. 1 196,48

(inc. VAT)

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Pack(s)
Per Pack
Per unit*
1 +Kr. 957,18Kr. 19,144

*price indicative

RS Stock No.:
577-631
Distrelec Article No.:
304-65-437
Mfr. Part No.:
ICK BGA 10 X 10
Brand:
Fischer Elektronik
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Brand

Fischer Elektronik

Product Type

Heatsink

For Use With

Ball Grid Array

Length

10mm

Width

10 mm

Height

6mm

Fastening

Adhesive

Colour

Black

Series

ICK

Finish

Black Anodised

Standards/Approvals

No

Application

Cooling

RoHS Status: Exempted

COO (Country of Origin):
DE
The Fischer Elektronik Heatsinks for BGAs are specifically designed for Ball Grid Array (BGA) components, ensuring optimal heat dissipation. With dimensions of 10 x 10 x 6 mm, these heatsinks precisely match BGA types and can be directly glued onto the component using double-sided adhesive thermal conductive foil for secure and efficient thermal management.

Black anodised

Universal socket

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