Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, QFN to DIP
- RS Stock No.:
- 741-9549
- Mfr. Part No.:
- W13052RC
- Brand:
- Winslow
Image representative of range
Bulk discount available
Subtotal (1 pack of 5 units)*
Kr.686 61
(exc. VAT)
Kr.858 26
(inc. VAT)
FREE delivery for online orders over 500,00 kr
In Stock
- 15 unit(s) ready to ship
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Pack* |
|---|---|---|
| 5 - 120 | Kr. 137,322 | Kr. 686,61 |
| 125 - 370 | Kr. 123,598 | Kr. 617,99 |
| 375 - 995 | Kr. 109,846 | Kr. 549,23 |
| 1000 - 1995 | Kr. 96,142 | Kr. 480,71 |
| 2000 + | Kr. 89,278 | Kr. 446,39 |
*price indicative
- RS Stock No.:
- 741-9549
- Mfr. Part No.:
- W13052RC
- Brand:
- Winslow
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | QFN | |
| Connection Gender A | Female | |
| Number of Contacts A | 24 | |
| Number of Contacts B | 24 | |
| Connection Gender B | Male | |
| Pitch | 2.54mm | |
| Connection B | DIP | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Standards/Approvals | No | |
| Contact Material | Brass | |
| Housing Material | Fibreglass | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A QFN | ||
Connection Gender A Female | ||
Number of Contacts A 24 | ||
Number of Contacts B 24 | ||
Connection Gender B Male | ||
Pitch 2.54mm | ||
Connection B DIP | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Standards/Approvals No | ||
Contact Material Brass | ||
Housing Material Fibreglass | ||
- COO (Country of Origin):
- GB
QFN to DIP Pin Adapters
'Adaptics' converting Dual-Flat No-Leads and Quad-Flat No-Leads packages (DFN and QFN) to Dual In Line Package (DIP) format.
IC Sockets-Package Adaptics
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
Related links
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