Infineon FF1500R12IE5BPSA1, Type N-Channel IGBT, 1500 A 1.2 kV, 10-Pin PRIME3, Surface
- RS Stock No.:
- 218-4323
- Mfr. Part No.:
- FF1500R12IE5BPSA1
- Brand:
- Infineon
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 218-4323
- Mfr. Part No.:
- FF1500R12IE5BPSA1
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | IGBT | |
| Maximum Continuous Collector Current Ic | 1500A | |
| Maximum Collector Emitter Voltage Vceo | 1.2kV | |
| Number of Transistors | 2 | |
| Maximum Power Dissipation Pd | 20mW | |
| Package Type | PRIME3 | |
| Mount Type | Surface | |
| Channel Type | Type N | |
| Pin Count | 10 | |
| Minimum Operating Temperature | -40°C | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 2.6V | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | No | |
| Height | 38.25mm | |
| Length | 247mm | |
| Width | 86 mm | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type IGBT | ||
Maximum Continuous Collector Current Ic 1500A | ||
Maximum Collector Emitter Voltage Vceo 1.2kV | ||
Number of Transistors 2 | ||
Maximum Power Dissipation Pd 20mW | ||
Package Type PRIME3 | ||
Mount Type Surface | ||
Channel Type Type N | ||
Pin Count 10 | ||
Minimum Operating Temperature -40°C | ||
Maximum Collector Emitter Saturation Voltage VceSAT 2.6V | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals No | ||
Height 38.25mm | ||
Length 247mm | ||
Width 86 mm | ||
Automotive Standard No | ||
The Infineon PrimePack dual IGBT module with TRENCHSTOP IGBT5 and .XT interconnection technology. It has collector emitter voltage of 1200 V. The N-Channel TRENCHSTOP and field stop IGBT Modules are suitable for hard switching and soft switching applications such as high power converters, UPS system, motor drives and solar applications.
Copper bonds for high current carrying capabilities
Sintering of chips for highest power cycling capabilities
Total losses reduced by up to 20%
Less cooling effort for same output power
Enables higher system overload conditions