TE Connectivity 0.5 mm Pitch 260 Way, Right Angle Board Mount DIMM Socket ,1.2 V, 500mA

Subtotal (1 reel of 250 units)*

Kr. 6 944,54

(exc. VAT)

Kr. 8 680,68

(inc. VAT)

Add to Basket
Select or type quantity
Stock information currently inaccessible
Reel(s)
Per Reel
Per unit*
1 +Kr. 6 944,54Kr. 27,778

*price indicative

RS Stock No.:
470-731
Distrelec Article No.:
304-59-556
Mfr. Part No.:
2309413-3
Brand:
TE Connectivity
Find similar products by selecting one or more attributes.
Select all

Brand

TE Connectivity

Memory Socket Type

DIMM

Product Type

DIMM Socket

Orientation

Right Angle

Insertion/Removal Method

Cam-In

Current

500mA

Contact Material

Copper Alloy

Contact Plating

Gold

Number of Contacts

260

Pitch

0.5mm

Mount Type

Board

Housing Material

High Temperature Thermoplastic

Termination Type

Surface Mount

Minimum Operating Temperature

-55°C

Latching

Yes

Row Spacing

8.2mm

Maximum Operating Temperature

85°C

Standards/Approvals

EU REACH Regulation (EC) No. 1907/2006, 2016, UL 94V-0, EU RoHS Directive 2011/65/EU, EU ELV Directive 2000/53/EC, China RoHS 2 Directive MIIT Order No 32

Series

DDR4 DIMM

Voltage

1.2 V

COO (Country of Origin):
CN
The TE Connectivity DDR4 SO DIMM Socket is an innovative solution designed for high-performance memory applications. With a compact stack height of 9.2 mm and a right-angle module orientation, this socket facilitates seamless integration into various printed circuit board layouts. Engineered to accommodate 260 positions, it boasts a centerline of 0.5 mm, making it an ideal choice for modern computing systems. This product combines advanced materials with a robust design to ensure durability and reliability in demanding environments, while also being compliant with significant industry standards. The retention features provide extra security, guaranteeing that the memory module remains firmly in place during operation. With its ability to withstand operating temperatures ranging from -55 to 85 °C, this socket is well-equipped to meet the rigorous requirements of today's technological landscape.

Designed for effortless installation and reliable performance

Utilizes high-temperature thermoplastic materials for enhanced durability

Incorporates stainless steel retention posts for added module security

Supports reflow solder processes for efficient assembly

Configured with standard keying for easy mating alignment

Low halogen content contributes to environmental compliance

Related links

Recently viewed