TE Connectivity 5316135 Series Board PCB Header, 0.6 mm Pitch, Unshrouded

Subtotal (1 tray of 50 units)*

Kr.2 619 00 

(exc. VAT)

Kr.3 273 75 

(inc. VAT)

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Tray(s)
Per Tray
Per unit*
1 +Kr. 2 619,00Kr. 52,38

*price indicative

RS Stock No.:
478-166
Mfr. Part No.:
5316135-3
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

5316135

Product Type

PCB Header

Pitch

0.6mm

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Contact Plating

Tin

Row Pitch

0.6mm

Termination Type

Solder

Maximum Operating Temperature

260°C

Standards/Approvals

2016 No Restricted Materials Above Threshold, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Out of Scope, EU REACH Regulation (EC) No. 1907/2006, EU RoHS Directive 2011/65/EU Compliant

Distrelec Product Id

304-65-299

COO (Country of Origin):
CN
The TE Connectivity Refined board-to-board connector embodies the perfect synergy of precision and reliability for advanced electronic applications. Designed with a free height of 0.6mm, it ensures optimal stacking performance while maintaining excellent solder process capabilities, withstanding temperatures of up to 260°C. The intelligent design makes it compatible with a range of high-speed applications, allowing for confident integration into various devices. With its low halogen content and compliance with stringent EU regulations, this connector not only guarantees superior functionality but also reinforces commitments to environmental responsibility. Its durable construction and robust specifications contribute to enhanced longevity and performance across diverse operational conditions, making it an ideal choice for engineers seeking dependable connectivity solutions.

Offers a free height measurement to accommodate diverse assembly needs

Complies with EU RoHS and ELV directives for responsible sourcing

Low halogen formulation promotes environmentally-friendly use

Solder process capability supports advanced manufacturing techniques

Versatile design suited for a range of board-to-board applications

Maintains high-performance standards while ensuring efficient space utilisation

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