Samtec ADF6 Series Vertical Surface PCB Socket, 40-Contact, 4 Row, 0.635 mm Pitch Solder
- RS Stock No.:
- 202-7890
- Mfr. Part No.:
- ADF6-40-03.5-L-4-2-A
- Brand:
- Samtec
Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 202-7890
- Mfr. Part No.:
- ADF6-40-03.5-L-4-2-A
- Brand:
- Samtec
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Number of Contacts | 40 | |
| Product Type | PCB Socket | |
| Number of Rows | 4 | |
| Sub Type | High Density Socket | |
| Current | 1.34A | |
| Pitch | 0.635mm | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Connector System | Board-to-Board | |
| Stacking Height | 5mm | |
| Voltage | 219 V | |
| Series | ADF6 | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 0.96mm | |
| Contact Material | Copper Alloy | |
| Contact Plating | Tin over Nickel, Gold | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | EU RoHS, EU REACH, CHINA RoHS | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Number of Contacts 40 | ||
Product Type PCB Socket | ||
Number of Rows 4 | ||
Sub Type High Density Socket | ||
Current 1.34A | ||
Pitch 0.635mm | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Vertical | ||
Connector System Board-to-Board | ||
Stacking Height 5mm | ||
Voltage 219 V | ||
Series ADF6 | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 0.96mm | ||
Contact Material Copper Alloy | ||
Contact Plating Tin over Nickel, Gold | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals EU RoHS, EU REACH, CHINA RoHS | ||
- COO (Country of Origin):
- US
The Samtec Connector is a low profile, ultra-slim surface mount socket. Edge Rate® contact system optimized for signal integrity performance. Supports 56 Gbps PAM4 (28 Gbps NRZ) applications.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design; 10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact system optimized for signal integrity performance
Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
Solder ball technology for simplified processing and self aligning
Additional stack heights and higher pin counts in development
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