Bergquist HC5000 Series Self-Adhesive Thermal Gap Pad, 0.06 in Thick, 5 W/mK, 8 in, 16in, Silicone

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Kr. 2 063,00

(exc. VAT)

Kr. 2 578,75

(inc. VAT)

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RS Stock No.:
282-6834
Mfr. Part No.:
GAP PAD TGP HC5000, 8in x 16in x 0.06
Brand:
Bergquist
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Brand

Bergquist

Product Type

Thermal Gap Pad

Thickness

0.06in

Thermal Conductivity

5W/mK

Self-Adhesive

Yes

Trade Name

HC5000

Conductive Material

Silicone

Width

16in

Length

8in

Standards/Approvals

No

Series

HC5000

RoHS Status: Exempted

COO (Country of Origin):
US
The Bergquist soft and compliant gap filling material with a thermal conductivity of 5.0 W per m K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.

High-compliance low compression stress

Fiberglass reinforced for shear and tear resistance

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