OCU-440-UE365-X-T OSA Opto, OCU-400 Series UV LED, 370nm, 2-Pin Surface Mount package
- RS Stock No.:
- 173-6288
- Mfr. Part No.:
- OCU-440-UE365-X-T
- Brand:
- OSA Opto
Stock information currently inaccessible
- RS Stock No.:
- 173-6288
- Mfr. Part No.:
- OCU-440-UE365-X-T
- Brand:
- OSA Opto
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | OSA Opto | |
| Number of LEDs | 1 | |
| Peak Wavelength | 370nm | |
| Package Type | SMD | |
| Lens Shape | Round | |
| Number of Pins | 2 | |
| Mounting Type | Surface Mount | |
| Height | 1mm | |
| Length | 3.8mm | |
| Width | 3.8mm | |
| Dimensions | 3.8 x 3.8 x 1mm | |
| Series | OCU-400 | |
| Select all | ||
|---|---|---|
Brand OSA Opto | ||
Number of LEDs 1 | ||
Peak Wavelength 370nm | ||
Package Type SMD | ||
Lens Shape Round | ||
Number of Pins 2 | ||
Mounting Type Surface Mount | ||
Height 1mm | ||
Length 3.8mm | ||
Width 3.8mm | ||
Dimensions 3.8 x 3.8 x 1mm | ||
Series OCU-400 | ||
OSA Opto Light has designed several PCB-based SMD-LED packages for various sizes, radiant characteristics and chip types. Almost all of our standard chips can be mounted in our SMD-packages. All devices can be characterized at 20mA, 2mA (low current) and under custom specific conditions. Most of them can be packaged tape-up and tape-down. The thermal resistance of the devices itself is about 150K/W (Kelvin/Watt), depending on chip technology a power dissipation up to 10mW can be realized.
packages: 1515
size: 3.8mm x 3.8mm x 0.9mm
view angle: 120°
substrate: AlN Ceramic
for High Power applications
technology: InGaN
soldering pads: silver plated
suitable for all SMT assembly methods
size: 3.8mm x 3.8mm x 0.9mm
view angle: 120°
substrate: AlN Ceramic
for High Power applications
technology: InGaN
soldering pads: silver plated
suitable for all SMT assembly methods
size: 3.2mm x 1.6mm x 1.2mm
circuit substrate: AIN Ceramics
Lead free solderable, soldering pads:silver
taped in 12 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible
circuit substrate: AIN Ceramics
Lead free solderable, soldering pads:silver
taped in 12 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible
Related links
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