- RS Stock No.:
- 798-4368
- Mfr. Part No.:
- EHS5-E miniPCie 3FF
- Brand:
- Cinterion
Discontinued product
- RS Stock No.:
- 798-4368
- Mfr. Part No.:
- EHS5-E miniPCie 3FF
- Brand:
- Cinterion
Technical Reference
Legislation and Compliance
- COO (Country of Origin):
- DE
Product Details
EHS5-E miniPCIe wireless module
The Cinterion 3G EHS5-E miniPCIe wireless module offers a 3G wireless connection to Industrial networks that require a bandwidth of up to 7.2 Mbps in the downlink and 5.76 Mbps in the uplink. The dual band 2G and 3G mini PCIe will present regional optimum Internet access connectivity and with its x86 architecture it will allow you to access intelligent systems such as cloud-based services.
The Cinterion M2M miniPCIe advanced temperature management function will mean that it can be used outdoors in extreme weather conditions, as well as inside for industrial equipment that lack heating and cooling systems. The EHS5-E module will react and automatically change the current radio performance to avoid it from overheating.
Compatible with USB and modem driver of MicrosoftR Windows 8™, Windows 7™, Windows Vista™, Windows XP™ and Linux kernel.
The Cinterion M2M miniPCIe advanced temperature management function will mean that it can be used outdoors in extreme weather conditions, as well as inside for industrial equipment that lack heating and cooling systems. The EHS5-E module will react and automatically change the current radio performance to avoid it from overheating.
Compatible with USB and modem driver of MicrosoftR Windows 8™, Windows 7™, Windows Vista™, Windows XP™ and Linux kernel.
Dual-Band UMTS (WCDMA/FDD): 900/2100 MHz (EHS5-E)
Dual-Band GSM: 900/1800 MHz (EHS5-E)
Transfer large amount of data
Industrial and commercial M2M applications
Advanced Temperature Management
Operating temperature: -40 °C to +85 °C
Plugs in via the 52-pin PCIe system connector
3GPP Release 7 Compliant Protocol Stack
SIM Application Toolkit , letter class c
Control via AT commands (Hayes, 3GPP TS 27.007 and 27.005)
HSPDA Cat.8 / HSUPA Cat.6 data rates
DL: max. 7.2 Mbps, UL: max. 5.76 Mbps
EDGE Class 12 data rates
DL: max. 237 kbps, UL: max. 237 kbps
Supply voltage range 3.0-3.6 V
Dimension: 51 ´ 30 ´ 4.7 mm
RoHS and EuP compliant
Dual-Band GSM: 900/1800 MHz (EHS5-E)
Transfer large amount of data
Industrial and commercial M2M applications
Advanced Temperature Management
Operating temperature: -40 °C to +85 °C
Plugs in via the 52-pin PCIe system connector
3GPP Release 7 Compliant Protocol Stack
SIM Application Toolkit , letter class c
Control via AT commands (Hayes, 3GPP TS 27.007 and 27.005)
HSPDA Cat.8 / HSUPA Cat.6 data rates
DL: max. 7.2 Mbps, UL: max. 5.76 Mbps
EDGE Class 12 data rates
DL: max. 237 kbps, UL: max. 237 kbps
Supply voltage range 3.0-3.6 V
Dimension: 51 ´ 30 ´ 4.7 mm
RoHS and EuP compliant
GSM/GPRS (Mobile Communications) - Modules
Specifications
Attribute | Value |
---|---|
Supported Bus Interfaces | ADC, HSIC HS, I2C, Serial, SPI |
Dimensions | 27.6 x 18.8 x 2.3mm |
Height | 2.3mm |
Length | 27.6mm |
Maximum Operating Temperature | +90 °C |
Minimum Operating Temperature | -40 °C |
Width | 18.8mm |