Amphenol Communications Solutions 1.27 mm Pitch 400 Way Surface Mount Surface Prototyping IC Socket

View all IC Sockets
Bulk discount available

Subtotal (1 unit)*

Kr.381 30 

(exc. VAT)

Kr.476 62 

(inc. VAT)

Add to Basket
Select or type quantity
Temporarily out of stock
  • Shipping from 22. juli 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units
Per unit
1 - 9Kr. 381,30
10 - 24Kr. 370,54
25 - 49Kr. 360,70
50 - 99Kr. 351,09
100 +Kr. 342,06

*price indicative

Packaging Options:
RS Stock No.:
182-2753
Mfr. Part No.:
74221-101LF
Brand:
Amphenol Communications Solutions
Find similar products by selecting one or more attributes.
Select all

Brand

Amphenol Communications Solutions

IC Socket Type

Prototyping Socket

Package Type

Surface Mount

Product Type

IC Socket

Current

450mA

Number of Contacts

400

Number of Rows

8

Pitch

1.27mm

Voltage

200 V

Orientation

Straight

Contact Material

Copper Alloy

Contact Plating

Gold

Termination Type

Solder

Row Pitch

1.27mm

Minimum Operating Temperature

-55°C

Socket Mount Type

Surface

Device Mount Type

Surface

Maximum Operating Temperature

85°C

Standards/Approvals

No

Series

Meg-Array

Housing Material

Liquid Crystal Polymer

COO (Country of Origin):
US
High density, high speed, discrete contact, array connector

Flexible ground distribution optimizes high speed signal integrity

10Gb/s differential pair performance with under 1% cross-talk

28Gb/s high speed performance documented for 4 mm and 6 mm stack height

Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market

1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space

Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility

6 PCB Stack heights: 4 mm to 14mm

8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform

High density standard BGA attachment lower assembly costs by using standard SMT processes

BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage

Patented BGA contact attachment preserves solder ball positioning

Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability

Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options

400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free

Related links