onsemi Isolated 2 Type N-Channel MOSFET, 16 A, 30 V Enhancement, 8-Pin WDFN FDMC7208S

Bulk discount available

Subtotal (1 pack of 5 units)*

Kr.89 12 

(exc. VAT)

Kr.111 40 

(inc. VAT)

Add to Basket
Select or type quantity
Last RS stock
  • Final 1 210 unit(s), ready to ship
Units
Per unit
Per Pack*
5 - 45Kr. 17,824Kr. 89,12
50 - 95Kr. 15,352Kr. 76,76
100 - 495Kr. 13,316Kr. 66,58
500 - 995Kr. 11,692Kr. 58,46
1000 +Kr. 10,662Kr. 53,31

*price indicative

Packaging Options:
RS Stock No.:
806-3490
Mfr. Part No.:
FDMC7208S
Brand:
onsemi
Find similar products by selecting one or more attributes.
Select all

Brand

onsemi

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

16A

Maximum Drain Source Voltage Vds

30V

Package Type

WDFN

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

7.5mΩ

Channel Mode

Enhancement

Forward Voltage Vf

0.82V

Maximum Gate Source Voltage Vgs

20 V

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

1.9W

Typical Gate Charge Qg @ Vgs

13nC

Transistor Configuration

Isolated

Maximum Operating Temperature

150°C

Length

3mm

Standards/Approvals

No

Width

3 mm

Height

0.75mm

Number of Elements per Chip

2

Automotive Standard

No

PowerTrench® SyncFET™ Dual MOSFET, Fairchild Semiconductor


Designed to minimise losses in power conversion, while maintaining excellent switching performance

High Performance Trench Technology for extremely low RDS(on)

SyncFET™ benefits from an efficient Schottky body diode

Applications in Synchronous Rectification DC-DC Converter, Motor Drives, networking point of load Low Side Switch

MOSFET Transistors, ON Semi


ON Semi offers a substantial portfolio of MOSFET devices that includes high-voltage (>250V) and low-voltage (<250V) types. The Advanced silicon technology provides smaller die sizes, which it is incorporated into multiple industry-standard and thermally-enhanced packages.

ON Semi MOSFETs provide superior design reliability from reduced voltage spikes and overshoot, to lower junction capacitance and reverse recovery charge, to elimination of additional external components to keep systems up and running longer.

Related links