Vishay IRFBE30 Type N-Channel Power MOSFET, 4.1 A, 800 V Enhancement, 3-Pin TO-220AB IRFBE30PBF

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Kr. 30,66

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Kr. 38,32

(inc. VAT)

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1 - 9Kr. 30,66
10 - 49Kr. 29,63
50 - 99Kr. 28,37
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250 +Kr. 25,51

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Packaging Options:
RS Stock No.:
541-1124
Distrelec Article No.:
171-15-208
Mfr. Part No.:
IRFBE30PBF
Brand:
Vishay
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Brand

Vishay

Channel Type

Type N

Product Type

Power MOSFET

Maximum Continuous Drain Current Id

4.1A

Maximum Drain Source Voltage Vds

800V

Package Type

TO-220AB

Series

IRFBE30

Mount Type

Through Hole

Pin Count

3

Maximum Drain Source Resistance Rds

Channel Mode

Enhancement

Maximum Power Dissipation Pd

125W

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

78nC

Maximum Gate Source Voltage Vgs

20V

Forward Voltage Vf

1.8V

Maximum Operating Temperature

150°C

Standards/Approvals

RoHS

Width

4.7mm

Height

9.01mm

Length

10.41mm

Automotive Standard

No

Vishay IRFBE30 Series Power MOSFET, 800V Drain Source Voltage, 4.1A Continuous Drain Current - IRFBE30PBF


This power MOSFET is a through‑hole N‑channel transistor designed for switching and power control in industrial electronics. It operates as an enhancement‑mode device suitable for high‑voltage applications, offering a combination of voltage handling and gate‑drive capability for demanding electrical systems.

Features and Benefits:


• 800V drain‑source voltage enables high‑voltage switching applications • 4.1A continuous drain current supports moderate load currents • 3 Ω maximum Rds reduces current loss during conduction • 78 nC typical gate charge allows predictable switching behaviour • 125W power dissipation manages thermal stress in power circuits • -55 °C to 150 °C operating range endures wide temperature extremes

Applications


• Suitable for high‑voltage power supplies and converters • Ideal for industrial motor drive switching stages • Used for solid‑state relay and protection circuitry • Can be used for load switching in automation panels

What gate voltage limits should I observe during design?


Gate drive must remain within ±20V maximum relative to source to prevent gate‑oxide stress.

How should thermal management be approached on a PCB?


Use a heatsink on the TO‑220AB package or a thermally conductive mounting solution to dissipate up to 125W of power under rated conditions.

What switching characteristics affect EMI in my design?


The typical gate charge of 78 nC at the specified gate drive influences rise and fall times, impacting switching transitions and electromagnetic emissions.

Is this device suitable for surface‑mounting techniques?


It is supplied in a TO‑220AB through‑hole package intended for mechanical mounting and conventional through‑hole assembly.

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