Infineon Isolated OptiMOS 2 N-Channel MOSFET, 300 mA, 60 V Enhancement, 6-Pin SC-88

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Subtotal (1 reel of 500 units)*

Kr. 615,00

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Kr. 770,00

(inc. VAT)

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Units
Per unit
Per Reel*
500 - 500Kr. 1,23Kr. 615,00
1000 - 2000Kr. 1,169Kr. 584,50
2500 - 4500Kr. 1,052Kr. 526,00
5000 +Kr. 1,046Kr. 523,00

*price indicative

RS Stock No.:
827-0002
Mfr. Part No.:
2N7002DWH6327XTSA1
Brand:
Infineon
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Brand

Infineon

Channel Type

N

Product Type

MOSFET

Maximum Continuous Drain Current Id

300mA

Maximum Drain Source Voltage Vds

60V

Series

OptiMOS

Package Type

SC-88

Mount Type

Surface

Pin Count

6

Maximum Drain Source Resistance Rds

4Ω

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

0.4nC

Forward Voltage Vf

960mV

Minimum Operating Temperature

-55°C

Maximum Gate Source Voltage Vgs

-20V, +20V

Maximum Power Dissipation Pd

500mW

Transistor Configuration

Isolated

Maximum Operating Temperature

150°C

Length

2mm

Standards/Approvals

No

Width

1.25mm

Height

800μm

Number of Elements per Chip

2

Automotive Standard

AEC-Q101

Infineon OptiMOS Series MOSFET, 60V Drain Source Voltage, 4Ω Drain Source Resistance - 2N7002DWH6327XTSA1


This MOSFET is a surface-mount N-channel transistor designed for low-power switching in constrained assemblies. It operates in enhancement mode and combines two elements on a single chip to deliver compact dual-die switching suitable for automotive-rated and industrial environments. The device is intended for board-level applications requiring modest current handling and controlled on-resistance.

Features and Benefits:


• 60V drain rating enables higher-voltage switching applications
• 4Ω maximum Rds reduces conduction losses during on-state
• 300mA continuous drain current supports low-current loads
• 0.4nC typical gate charge allows fast, efficient switching
• 500mW power dissipation suits low-power, thermally limited designs
• -55°C to 150°C operating range ensures thermal endurance

Applications


• Suitable for microcontroller-driven load switching
• Ideal for interfacing sensors in automotive systems
• Used with battery-management balancing circuits
• Can be used for small relay replacement duties
• Appropriate for compact SMD power-path control

What package and pin count should I prepare for PCB layout?


The device is supplied in a small SC-88 surface-mount package with six pins, so pads and thermal relief should match the SC-88 footprint.

How does the dual-element chip affect parallel operation?


Two elements on the same die permit compact dual-channel arrangements without external matching, but total thermal limits remain per package.

What gate and drain voltage limits must be observed?


The gate-source voltage must not exceed ±20V while the drain-source voltage limit is 60V to avoid device stress.

What forward voltage can be expected when conducting?


A forward voltage measurement of approximately 0.96V applies under specified test conditions for relevant conduction paths.

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